Profile and Surface Measurement Tool for High Aspect-ratio Microstructures
نویسندگان
چکیده
منابع مشابه
Post-CMOS Processing for High-Aspect-Ratio Integrated Silicon Microstructures
We present a new fabrication sequence for integrated-silicon microstructures designed and manufactured in a conventional complentary metal–oxide–semiconductor (CMOS) process. The sequence employs a post-CMOS deep silicon backside etch, which allows fabrication of high aspect ratio (25:1) and flat (greater than 10 mm radius of curvature) MEMS devices with integrated circuitry. A comb-drive reson...
متن کاملFabrication of High-Aspect-Ratio Microstructures Using Excimer Lasers
An excimer laser micromachining system is developed to study the process in fabricating high-aspect-ratio microstructures. Specifically, the study experimentally examines process efficiency and the impact of changing major laser operating parameters on the resulting microstructural shapes and morphology. The materials considered in the study include glass, silicon, and aluminum. The ablation or...
متن کاملProton beam writing and electroplating for the fabrication of high aspect ratio Au microstructures
We present an approach to fabricate tall high aspect ratio Au microstructures by means of proton beam direct writing. Combining proton beam direct writing and electroplating, we successfully produced gold structures with sub-micrometer lateral dimensions, structure heights in excess of 11 lm, and aspect ratios over 28. Sidewall quality of the Au structures was improved by lowering the process t...
متن کاملUV activation of polymeric high aspect ratio microstructures: ramifications in antibody surface loading for circulating tumor cell selection.
The need to activate thermoplastic surfaces using robust and efficient methods has been driven by the fact that replication techniques can be used to produce microfluidic devices in a high production mode and at low cost, making polymer microfluidics invaluable for in vitro diagnostics, such as circulating tumor cell (CTC) analysis, where device disposability is critical to mitigate artifacts a...
متن کاملFabrication of multi-layer substrates for high aspect ratio single crystalline microstructures
This paper reports a new method for making multi-layer substrates (h4LS) for high aspect ratio single crystalline movable microstructures using a group of technologies, such as direct wafer bonding (DWJ3) , chemical mechanical polishing (CMP) , and reactive ion etching (RIE) . As a first example, Si-SiO,-polySi-SiO,-Si sandwich wafers were fabricated using CMP and DWB. Subsequently, free-standi...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: JSME International Journal Series C
سال: 2003
ISSN: 1344-7653,1347-538X
DOI: 10.1299/jsmec.46.916